Paragon Semiconductor Lighting Technology Co., Ltd.

Multi-chip LED packaging solutions

Paragon Semiconductor Lighting Technology Co., Ltd. is good at multi-chip LED packaging for area light sources used indoors and outdoors. It uses chip-on-board (COB) technique to fix LED chips on aluminum board coated with gold layer, an ideal formula for better thermal conductivity.

Unique thermal-dissipation technique allows the company’s packages to generate only one to two degrees Celsius of thermal resistance per watt. Excellent primary optics design enables its packages to evenly beam soft illumination at angle of 170 degrees, eliminating the need for secondary optics design. Also, the optics design lets a substantial 95% of the illumination from LED devices through primary lens. Average luminous efficacy is 100 lumens per watt.

Good phosphor formula and well-controlled coating process allow the company's package to deliver precise color temperature and CIE coordination that meets the specification of ANSI and Energy Star.

The company’s packages are categorized into alternating current (AC) and directing current (DC) types. All of them are compliant with RoHS standard.

So far, the company has won over 100 patents, in Taiwan, the U.S. Europe, Japan, South Korea and mainland China, on package, process, structure and circuit design. Cashing in on advanced technology and innovative ideas, Paragon Semiconductor Lighting has

successfully combined the LED multi-chip package with ASIC on the identical substrate, an ideal design or well controlling electrical current.

Paragon Semiconductor Lighting Technology Co., Ltd.

NO.37, Lane 37, Keji 2nd Rd., Guishan

Township, Taoyuan County, Taiwan 33383

Tel: 886-3-396-3518 Fax: 886-3-397-2255

E-mail:sales@paragonled.com

Website: www.paragonled.com

China Office (Dongguan)

ROOM 1311, Block D, Central Wealth District,Yuanmei East

Rd., Southern District of Dongguan City, Guangdong, China

Tel: +86-769-3338-3910 FAX: +86-769-2285-9161

E-mail: sales01@paragonled.com